[1]Noh, B.-I., & Jung, S.-B. (2008). Characteristics of environmental factor for electrochemical migration on printed circuit board. Journal of Materials Science: Materials in Electronics, 19, 952-956. https://doi.org/10.1007/s10854-007-9421-3
[2] Nishinaka, H., Sakamoto, Y., Murayama, Y., & Iwasa, A. (2002). The effects of the environmental conditions of some Zener voltage references. Conference Digest Conference on Precision Electromagnetic Measurements. https://doi.org/10.1109/CPEM.2002.1034772
[3] Van Wuytswinkel, G., Dreezen, G., & Luyckx, G. (2002). The effects of temperature and humidity aging on the contact resistance of novel electrically conductive adhesives. 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002, Conference Proceedings (Cat. No. 02EX599). https://doi.org/10.1109/POLYTR.2002.1020219
[4] Baylakoğlu, İ., Fortier, A., Kyeong, S., Ambat, R., Conseil-Gudla, H., Azarian, M. H., & Pecht, M. G. (2021). The detrimental effects of water on electronic devices. e-Prime-Advances in Electrical Engineering, Electronics and Energy, 1, 100016. https://doi.org/10.1016/j.prime.2021.100016
[5] Lv, Z., Liu, X., Jia, B., Wang, H., Wu, Y., & Lu, Z. (2016). Development of a novel high-entropy alloy with eminent efficiency of degrading azo dye solutions. Scientific reports, 6(1), 34213. https://doi.org/10.1038/srep34213
[6] Cirolia, F., & Finan, C. (2001). The effects of airborne contaminants on electronic power supplies. APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No. 01CH37181). https://doi.org/10.1109/APEC.2001.911654
[7] Kumazawa, T., Oishi, M., Todoki, M., & Watanabe, T. (1997). Physical and chemical structure change of filled epoxy due to water absorption. Proceedings of 5th International Conference on Properties and Applications of Dielectric Materials.https://doi.org/ 10.1109/ICPADM.1997.617644
[8] Arnaldi, R., Chiavassa, E., Colla, A., Cortese, P., Dellacasa, G., De Marco, N., Ferretti, A., Gallio, M., Gemme, R., & Musso, A. (2004). Dependence of bakelite resistivity on temperature and humidity. IEEE Symposium Conference Record Nuclear Science 2004. https://doi.org/10.1109/NSSMIC.2004.1462249
[9] Wang, J. Z., Dillard, D. A., & Kamke, F. A. (1991). Transient moisture effects in materials. Journal of materials science, 26, 5113-5126. https://doi.org/10.1007/BF01143201
[10] Ma, L., Sood, B., & Pecht, M. (2010). Effects of moisture content on dielectric constant and dissipation factor of printed circuit board materials. ECS Transactions, 27(1), 227. https://doi.org/ 10.1149/1.3360624
[11] Pecht, M. G., Ardebili, H., Shukla, A. A., Hagge, J. K., & Jennings, D. (1999). Moisture ingress into organic laminates. IEEE Transactions on Components and Packaging Technologies, 22(1), 104-110. https://doi.org/10.1109/6144.759359
[12] Zecha, H., Früh, C., Ratchev, R., Biehl, E., & Zerna, T. (2013). Absorption and diffusion of water in printed circuit boards. Proceedings of the 36th International Spring Seminar on Electronics Technology. https://doi.org/10.1109/ISSE.2013.6648227
[13] Fan, X., Lee, S. R., & Han, Q. (2009). Experimental investigations and model study of moisture behaviors in polymeric materials. Microelectronics Reliability, 49(8), 861-871. https://doi.org/ 10.1016/j.microrel.2009.03.006
[14] Mcmaster, M. G., & Soane, D. S. (1989). Water sorption in epoxy thin films. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 12(3), 373-386. https://doi.org/ 10.1109/33.35485
[15] Placette, M. D., Fan, X., Zhao, J.-H., & Edwards, D. (2012). Dual stage modeling of moisture absorption and desorption in epoxy mold compounds. Microelectronics Reliability, 52(7), 1401-1408. https://doi.org/10.1016/j.microrel.2012.03.008
[16] Ardebili, H., Hillman, C., Natishan, M. A. E., McCluskey, P., Pecht, M. G., & Peterson, D. (2002). A comparison of the theory of moisture diffusion in plastic encapsulated microelectronics with moisture sensor chip and weight-gain measurements. IEEE Transactions on Components and Packaging Technologies, 25(1), 132-139. https://doi.org/ 10.1109/6144.991185
[17] Lu, M., Shim, M., & Kim, S. (2001). Effects of moisture on properties of epoxy molding compounds. Journal of Applied Polymer Science, 81(9), 2253-2259. https://doi.org/10.1002/app.1664
[18] Tay, A. A., & Lin, T. (1996). Moisture diffusion and heat transfer in plastic IC packages. IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 19(2), 186-193. https://doi.org/10.1109/95.506103
[19] Khoshnaw, F. M. (2010). Evaluation the moisture effects on the performance of electronic devices. 2010 IEEE 14th Workshop on Signal Propagation on Interconnects. https://doi.org/ 10.1109/SPI.2010.5483575
[20] Grundy, R. (2005). Recommended data center temperature & humidity preventing costly downtime caused by environment conditions. AVTECH Software.
[21] Jahkonen, J., Puolakka, M., & Halonen, L. (2013). Thermal management of outdoor LED lighting systems and streetlights—Variation of ambient cooling conditions. Leukos, 9(3), 155-176. https://doi.org/10.1582/LEUKOS.2013.09.03.001
[22] Joshy, S., Verdingovas, V., Jellesen, M. S., & Ambat, R. (2019). Circuit analysis to predict humidity related failures in electronics- Methodology and recommendations. Microelectronics Reliability, 93, 81-88. https://doi.org/10.1016/j.microrel.2018.12.010
[23] Conseil-Gudla, H., Jellesen, M. S., & Ambat, R. (2020). Humidity control in electronic devices: water sorption properties of desiccants and related humidity build-up in enclosures. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11(2), 324-332. https://doi.org/10.1109/TCPMT.2020.3045495.
[24] Bahru, R., Zamri, M. F. M. A., Shamsuddin, A. H., & Mohamed, M. A. (2022). Simulation design for thermal model from various materials in electronic devices: A review. Numerical Heat Transfer, Part A: Applications, 82(10), 640–665. https://doi.org/10.1080/10407782.2022.2083842
[25] Meteoblue. (n.d.). Climate modelled: Noshahr Airport, Iran [Modeled climate chart for 366 days: 2023-01-01 to 2024-01-01]. https://www.meteoblue.com/en/weather/historyclimate/climatemodelled/noshahr-airport_iran_7457199
[26] Meteoblue. (n.d.). Climate modelled: Tabriz Airport, Iran [Modeled climate chart for 366 days: 2023-01-01 to 2024-01-01]. www.meteoblue.com/en/weather/forecast/modelclimate/tabriz_iran_113646
[27] Amerine, M. A., Berg, H. W., & Cruess, W. V. (2021). Guide to sources for agricultural and biological research. In ASHRAE handbook (462). American Society of Refrigerating and Air Conditioning Engineers.
[28] COMSOL. (n.d.). COMSOL Multiphysics Reference Manual (Version 5.5). from https://doc.comsol.com/5.5/doc/com.comsol.help.comsol/COMSOL_Reference
[29] COMSOL. (2022). Theory for heat transfer in moist air. In COMSOL Multiphysics Documentation (Version 6.1). from https://doc.comsol.com/6.1/doc/com.comsol.help.comsol/COMSOL_Reference
[30] Bird, R. B., Stewart, W. E., & Lightfoot, E. N. (2007). Transport phenomena (Revised 2nd ed.). John Wiley & Sons, Inc.
[31] Staliulionis, Z., Paukštaitis, L., & Miliauskas, G. (2022). Experimental study of transient heat transfer and temperature dynamics in the electronics enclosures. 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics 1 and Microsystems (EuroSimE), 2 1-7. https://doi.org/10.1109/EuroSimE54907.2022.9758845
[32] Mottahed, B. D., & Manoochehri, S. (1999). Design considerations for electronic enclosures utilizing polymeric materials. Polymer-Plastics Technology and Engineering, 38(5), 883-925. https://doi.org/10.1080/03602559909351621
